XGZP168

XGZP168 is a surface mounting pressure sensor based on CFSensor silicon based piezoresistivepressure sensor die. The sensor die is bonded on a substrate with a plastic cap and packaged in a 6-pinSOP or DIP. The small size and high reliability of on-chip integration make this sensor a simple andeconomical choice for high volume application in a variety of industries. With standard SOP6 or DIP6package, XGZP168 is easy for users to install by SMT or through hole board assembly. With good repeatability, linearity, stability and sensibility, XGZP168 is very facile for users tocalibrateoutput & thermal drift and make temperature compensation by using exterior operational amplifier or
integrated circuit.(For calibrated pressure sensor if required,please refer to CFSensor pressure sensor
module series)
The XGZP168 pressure sensor is intended for using with non-corrosive gas or air. It is highly
prohibited to choke the side of pressure diaphragm during actual application. Please consult us if apressure medium other then air is to be used.