XC7Z035-2FFG900I

The Zynq-7000 family offers the flexibility and scalability of an FPGA, while providing performance, power, and ease of use
typically associated with ASIC and ASSPs. The range of devices in the Zynq-7000 family allows designers to target
cost-sensitive as well as high-performance applications from a single platform using industry-standard tools. While each
device in the Zynq-7000 family contains the same PS, the PL and I/O resources vary between the devices. As a result, the
Zynq-7000 and Zynq-7000S SoCs are able to serve a wide range of applications including:
• Automotive driver assistance, driver information, and infotainment
• Broadcast camera
• Industrial motor control, industrial networking, and machine vision
• IP and Smart camera
• LTE radio and baseband
• Medical diagnostics and imaging
• Multifunction printers
• Video and night vision equipment
The Zynq-7000 architecture enables implementation of custom logic in the PL and custom software in the PS. It allows for
the realization of unique and differentiated system functions. The integration of the PS with the PL allows levels of
performance that two-chip solutions (e.g., an ASSP with an FPGA) cannot match due to their limited I/O bandwidth, latency,
and power budgets.
Xilinx offers a large number of soft IP for the Zynq-7000 family. Stand-alone and Linux device drivers are available for the
peripherals in the PS and the PL. The Vivado® Design Suite development environment enables a rapid product
development for software, hardware, and systems engineers. Adoption of the ARM-based PS also brings a broad range of
third-party tools and IP providers in combination with Xilinx’s existing PL ecosystem.
The inclusion of an application processor enables high-level operating system support, e.g., Linux. Other standard operating
systems used with the Cortex-A9 processor are also available for the Zynq-7000 family.
The PS and the PL are on separate power domains, enabling the user of these devices to power down the PL for power
management if required. The processors in the PS always boot first, allowing a software centric approach for PL
configuration. PL configuration is managed by software running on the CPU, so it boots similar to an ASSP.


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    SPECIFICATION

    ARM Cortex-A9 Based
    Application Processor Unit (APU)
    • 2.5 DMIPS/MHz per CPU
    • CPU frequency: Up to 1 GHz
    • Coherent multiprocessor support
    • ARMv7-A architecture
    • TrustZone® security
    • Thumb®-2 instruction set
    • Jazelle® RCT execution Environment Architecture
    • NEON™ media-processing engine
    • Single and double precision Vector Floating Point Unit (VFPU)
    • CoreSight™ and Program Trace Macrocell (PTM)
    • Timer and Interrupts
    • Three watchdog timers
    • One global timer
    • Two triple-timer counters
    Caches
    • 32 KB Level 1 4-way set-associative instruction and data caches
    (independent for each CPU)
    • 512 KB 8-way set-associative Level 2 cache
    (shared between the CPUs)
    • Byte-parity support
    On-Chip Memory
    • On-chip boot ROM
    • 256 KB on-chip RAM (OCM)
    • Byte-parity support
    External Memory Interfaces
    • Multiprotocol dynamic memory controller
    • 16-bit or 32-bit interfaces to DDR3, DDR3L, DDR2, or LPDDR2
    memories
    • ECC support in 16-bit mode
    • 1GB of address space using single rank of 8-, 16-, or 32-bit-wide
    memories
    • Static memory interfaces
    • 8-bit SRAM data bus with up to 64 MB support
    • Parallel NOR flash support
    • ONFI1.0 NAND flash support (1-bit ECC)
    • 1-bit SPI, 2-bit SPI, 4-bit SPI (quad-SPI), or two quad-SPI (8-bit)
    serial NOR flash
    8-Channel DMA Controller
    • Memory-to-memory, memory-to-peripheral, peripheral-to-memory,
    and scatter-gather transaction support
    I/O Peripherals and Interfaces
    • Two 10/100/1000 tri-speed Ethernet MAC peripherals with
    IEEE Std 802.3 and IEEE Std 1588 revision 2.0 support
    • Scatter-gather DMA capability
    • Recognition of 1588 rev. 2 PTP frames
    • GMII, RGMII, and SGMII interfaces
    • Two USB 2.0 OTG peripherals, each supporting up to 12 Endpoints
    • USB 2.0 compliant device IP core
    • Supports on-the-go, high-speed, full-speed, and low-speed
    modes
    • Intel EHCI compliant USB host
    • 8-bit ULPI external PHY interface
    • Two full CAN 2.0B compliant CAN bus interfaces
    • CAN 2.0-A and CAN 2.0-B and ISO 118981-1 standard
    compliant
    • External PHY interface
    • Two SD/SDIO 2.0/MMC3.31 compliant controllers
    • Two full-duplex SPI ports with three peripheral chip selects
    • Two high-speed UARTs (up to 1 Mb/s)
    • Two master and slave I2C interfaces
    • GPIO with four 32-bit banks, of which up to 54 bits can be used with
    the PS I/O (one bank of 32b and one bank of 22b) and up to 64 bits
    (up to two banks of 32b) connected to the Programmable Logic
    • Up to 54 flexible multiplexed I/O (MIO) for peripheral pin assignments
    Interconnect
    • High-bandwidth connectivity within PS and between PS and PL
    • ARM AMBA® AXI based
    • QoS support on critical masters for latency and bandwidth control

    Programmable Logic (PL)
    Configurable Logic Blocks (CLB)
    • Look-up tables (LUT)
    • Flip-flops
    • Cascadeable adders
    36 Kb Block RAM
    • True Dual-Port
    • Up to 72 bits wide
    • Configurable as dual 18 Kb block RAM
    DSP Blocks
    • 18 x 25 signed multiply
    • 48-bit adder/accumulator
    • 25-bit pre-adder
    Programmable I/O Blocks
    • Supports LVCMOS, LVDS, and SSTL
    • 1.2V to 3.3V I/O
    • Programmable I/O delay and SerDes
    JTAG Boundary-Scan
    • IEEE Std 1149.1 Compatible Test Interface
    PCI Express® Block
    • Supports Root complex and End Point configurations
    • Supports up to Gen2 speeds
    • Supports up to 8 lanes
    Serial Transceivers
    • Up to 16 receivers and transmitters
    • Supports up to 12.5 Gb/s data rates
    Two 12-Bit Analog-to-Digital Converters
    • On-chip voltage and temperature sensing
    • Up to 17 external differential input channels
    • One million samples per second maximum conversion rate