XC7A35T-2CSG324I

• Advanced high-performance FPGA logic based on real 6-input lookup table (LUT) technology configurable as distributed memory.
• 36 Kb dual-port block RAM with built-in FIFO logic for on-chip data
buffering.
• High-performance SelectIO™ technology with support for DDR3
interfaces up to 1,866 Mb/s.
• High-speed serial connectivity with built-in multi-gigabit transceivers
from 600 Mb/s to max. rates of 6.6 Gb/s up to 28.05 Gb/s, offering a
special low-power mode, optimized for chip-to-chip interfaces.
• A user configurable analog interface (XADC), incorporating dual
12-bit 1MSPS analog-to-digital converters with on-chip thermal and
supply sensors.
• DSP slices with 25 x 18 multiplier, 48-bit accumulator, and pre-adder
for high-performance filtering, including optimized symmetric
coefficient filtering.
• Powerful clock management tiles (CMT), combining phase-locked
loop (PLL) and mixed-mode clock manager (MMCM) blocks for high
precision and low jitter.
• Quickly deploy embedded processing with MicroBlaze™ processor.
• Integrated block for PCI Express® (PCIe), for up to x8 Gen3
Endpoint and Root Port designs.
• Wide variety of configuration options, including support for
commodity memories, 256-bit AES encryption with HMAC/SHA-256
authentication, and built-in SEU detection and correction.
• Low-cost, wire-bond, bare-die flip-chip, and high signal integrity flipchip packaging offering easy migration between family members in
the same package. All packages available in Pb-free and selected
packages in Pb option.
• Designed for high performance and lowest power with 28 nm,
HKMG, HPL process, 1.0V core voltage process technology and
0.9V core voltage option for even lower power.