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    STM32F412CGU6

    STM32F412XE/G devices are based on the high-performance Arm® Cortex® -M4 32-bit
    RISC core operating at a frequency of up to 100 MHz. Their Cortex®-M4 core features a
    Floating point unit (FPU) single precision which supports all Arm single-precision dataprocessing instructions and data types. It also implements a full set of DSP instructions and
    a memory protection unit (MPU) which enhances application security.
    STM32F412XE/G devices belong to the STM32 Dynamic Efficiency™ product line (with
    products combining power efficiency, performance and integration) while adding a new
    innovative feature called Batch Acquisition Mode (BAM) allowing even more power
    consumption saving during data batching.
    STM32F412XE/G devices incorporate high-speed embedded memories (up to 1 Mbyte of
    flash memory, 256 Kbytes of SRAM), and an extensive range of enhanced I/Os and
    peripherals connected to two APB buses, three AHB buses and a 32-bit multi-AHB bus
    matrix.
    All devices offer one 12-bit ADC, a low-power RTC, twelve general-purpose 16-bit timers,
    two PWM timers for motor control and two general-purpose 32-bit timers.
    They also feature standard and advanced communication interfaces:
    – Up to four I2Cs, including one I2C supporting Fast-Mode Plus
    – Five SPIs
    – Five I2Ss of which two are full duplex. To achieve audio class accuracy, the I2S peripherals
    can be clocked via a dedicated internal audio PLL, or via an external clock to allow
    synchronization.
    – Four USARTs
    – An SDIO/MMC interface
    – A USB 2.0 OTG full-speed interface
    – Two CANs.
    In addition, STM32F412xE/G devices embed advanced peripherals:
    – A flexible static memory controller interface (FSMC)
    – A Quad-SPI memory interface
    – A digital filter for sigma modulator (DFSDM), two filters, up to four inputs, and support of
    microphone MEMs.
    STM32F412xE/G devices are offered in 7 packages ranging from 48 to 144 pins. The set of
    available peripherals depends on the selected package.
    The STM32F412xE/G operates in the -40 to +125 °C temperature range from a 1.7 (PDR
    OFF) to 3.6 V power supply. A comprehensive set of power-saving modes allows the design
    of low-power applications.

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      SPECIFICATION

      • Includes ST state-of-the-art patented
      technology
      • Dynamic efficiency line with BAM (Batch
      acquisition mode)
      • Core: Arm® 32-bit Cortex®-M4 CPU with FPU,
      Adaptive real-time accelerator (ART
      Accelerator™) allowing 0-wait state execution
      from flash memory, frequency up to 100 MHz,
      memory protection unit,
      125 DMIPS/1.25 DMIPS/MHz (Dhrystone 2.1),
      and DSP instructions
      • Memories
      – Up to 1 Mbyte of flash memory
      – 256 Kbytes of SRAM
      – Flexible external static memory controller
      with up to 16-bit data bus: SRAM, PSRAM,
      NOR flash memory
      – Dual mode Quad-SPI interface
      • LCD parallel interface, 8080/6800 modes
      • Clock, reset and supply management
      – 1.7 V to 3.6 V application supply and I/Os
      – POR, PDR, PVD and BOR
      – 4-to-26 MHz crystal oscillator
      – Internal 16 MHz factory-trimmed RC
      – 32 kHz oscillator for RTC with calibration
      – Internal 32 kHz RC with calibration
      • Power consumption
      – Run: 112 µA/MHz (peripheral off)
      – Stop (Flash in Stop mode, fast wakeup
      time): 50 µA typical at 25 °C; 75 µA max at
      25 °C
      – Stop (flash memory in Deep power down
      mode, slow wakeup time): down to 18 µA
      at 25 °C; 40 µA max at 25 °C
      – Standby: 2.4 µA at 25 °C / 1.7 V without
      RTC; 12 µA at 85 °C at 1.7 V
      – VBAT supply for RTC: 1 µA at 25 °C
      1×12-bit, 2.4 MSPS ADC: up to 16
      channels
      • 2x digital filters for sigma delta modulator,
      4x PDM interfaces, stereo microphone support
      • General-purpose DMA: 16-stream DMA
      • Up to 17 timers: up to twelve 16-bit timers, two
      32-bit timers up to 100 MHz each with up to
      four IC/OC/PWM or pulse counter and
      quadrature (incremental) encoder input, two
      watchdog timers (independent and window),
      one SysTick timer
      • Debug mode
      – Serial wire debug (SWD) and JTAG
      – Cortex®-M4 Embedded Trace Macrocell™
      • Up to 114 I/O ports with interrupt capability
      – Up to 109 fast I/Os up to 100 MHz
      – Up to 114 five V-tolerant I/Os
      • Up to 17 communication interfaces
      – Up to 4x I2C interfaces (SMBus/PMBus)
      – Up to 4 USARTs (2 x 12.5 Mbit/s,
      2 x 6.25 Mbit/s), ISO 7816 interface, LIN,
      IrDA, modem control)
      – Up to 5 SPI/I2Ss (up to 50 Mbit/s, SPI or
      I2S audio protocol), out of which 2 muxed
      full-duplex I2S interfaces
      – SDIO interface (SD/MMC/eMMC)
      – Advanced connectivity: USB 2.0 full-speed
      device/host/OTG controller with PHY
      – 2x CAN (2.0B Active)
      • True random number generator
      • CRC calculation unit
      • 96-bit unique ID
      • RTC: subsecond accuracy, hardware calendar
      • All packages are ECOPACK2 compliant