SMD1206P020TF

This product line enables installation in limited
space applications. These devices offer wide
range in hold currents from 0.125 A to 1.50 A and
voltages from 6 V to 30 V . The SMD1206 product
line is suitable for high density circuit board
applications in computers, cellular phone and
general electronics.
Suitable for refl ow soldering

Packaging
A Blistertape and reel Ø 178 mm
Materials
Terminals: Solder-plated copper
TS: Solder Material: 63/37 SnPb
TF: Lead free plating on request
Max. Device Surface Temperature in Tripped State
125 °C
Operating / Storage Temperature
-40 ºC to +85 ºC (consider derating)
Humidity Ageing
+85 °C, 85% R.H., 1000 hours, ± 5 % typical
resistance change
Vibration
MIL-STD-883C, Method 2007.1, Condition A,
no change
Thermal Shock
MIL-STD-202F, Method 107G
+85 °C to -40 °C 20 times, -30 % typical resistance
change
Solderability
Meets EIA Specifi cation RS186-9E,
ANSI/J-STD-002, Category 3
Refl ow only
Solvent Resistance
MIL-STD-202, Method 215, no change
Marking
“P”, Part Code