R5F100GEAFB#10

This chapter describes the following electrical specifications.
Target products A: Consumer applications TA = −40 to +85°C
R5F100xxAxx, R5F101xxAxx
D: Industrial applications TA = −40 to +85°C
R5F100xxDxx, R5F101xxDxx
G: Industrial applications when TA = −40 to +105°C products is used in the range of TA = −40 to +85°C
R5F100xxGxx
Cautions 1. The RL78 microcontrollers have an on-chip debug function, which is provided for development
and evaluation. Do not use the on-chip debug function in products designated for mass
production, because the guaranteed number of rewritable times of the flash memory may be
exceeded when this function is used, and product reliability therefore cannot be guaranteed.
Renesas Electronics is not liable for problems occurring when the on-chip debug function is
used.
2. With products not provided with an EVDD0, EVDD1, EVSS0, or EVSS1 pin, replace EVDD0 and EVDD1 with
VDD, or replace EVSS0 and EVSS1 with VSS.
3. The pins mounted depend on the product. Refer to 2.1 Port Function to 2.2.1 Functions for each
product in the RL78/G13 User’s Manual.


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    SPECIFICATION

    Ultra-low power consumption technology
     VDD = single power supply voltage of 1.6 to 5.5 V
     HALT mode
     STOP mode
     SNOOZE mode
    RL78 CPU core
     CISC architecture with 3-stage pipeline
     Minimum instruction execution time: Can be changed
    from high speed (0.03125 μs: @ 32 MHz operation
    with high-speed on-chip oscillator) to ultra-low speed
    (30.5 μs: @ 32.768 kHz operation with subsystem
    clock)
     Address space: 1 MB
     General-purpose registers: (8-bit register × 8) × 4
    banks
     On-chip RAM: 2 to 32 KB
    Code flash memory
     Code flash memory: 16 to 512 KB
     Block size: 1 KB
     Prohibition of block erase and rewriting (security
    function)
     On-chip debug function
     Self-programming (with boot swap function/flash shield
    window function)
    Data Flash Memory
     Data flash memory: 4 KB to 8 KB
     Back ground operation (BGO): Instructions can be
    executed from the program memory while rewriting the
    data flash memory.
     Number of rewrites: 1,000,000 times (TYP.)
     Voltage of rewrites: VDD = 1.8 to 5.5 V
    High-speed on-chip oscillator
     Select from 32 MHz, 24 MHz, 16 MHz, 12 MHz, 8 MHz,
    6 MHz, 4 MHz, 3 MHz, 2 MHz, and 1 MHz
     High accuracy: +/- 1.0 % (VDD = 1.8 to 5.5 V, TA = -20
    to +85°C)
    Operating ambient temperature
     TA = -40 to +85°C (A: Consumer applications, D:
    Industrial applications )
     TA = -40 to +105°C (G: Industrial applications)
    Power management and reset function
     On-chip power-on-reset (POR) circuit
     On-chip voltage detector (LVD) (Select interrupt and
    reset from 14 levels)
    DMA (Direct Memory Access) controller
     2/4 channels
     Number of clocks during transfer between 8/16-bit
    SFR and internal RAM: 2 clocks
    Multiplier and divider/multiply-accumulator
     16 bits × 16 bits = 32 bits (Unsigned or signed)
     32 bits ÷ 32 bits = 32 bits (Unsigned)
     16 bits × 16 bits + 32 bits = 32 bits (Unsigned or
    signed)
    Serial interface
     Simplified SPI (CSI Note 1): 2 to 8 channels
     UART/UART (LIN-bus supported): 2 to 4 channels
     I2C/Simplified I2C communication: 3 to 10 channels
    Timer
     16-bit timer: 8 to 16 channels
     12-bit interval timer: 1 channel
     Real-time clock: 1 channel (calendar for 99 years,
    alarm function, and clock
    correction function)
     Watchdog timer: 1 channel (operable with the
    dedicated low-speed on-chip
    oscillator)
    A/D converter
     8/10-bit resolution A/D converter (VDD = 1.6 to 5.5 V)
     Analog input: 6 to 26 channels
     Internal reference voltage (1.45 V) and temperature
    sensor Note 2
    I/O port
     I/O port: 16 to 120 (N-ch open drain I/O [withstand
    voltage of 6 V]: 0 to 4, N-ch open drain I/O
    [VDD withstand voltage Note 3/EVDD withstand
    voltage Note 4]: 5 to 25)
     Can be set to N-ch open drain, TTL input buffer, and
    on-chip pull-up resistor
     Different potential interface: Can connect to a 1.8/2.5/3
    V device
     On-chip key interrupt function
     On-chip clock output/buzzer output controller
    Others
     On-chip BCD (binary-coded decimal) correction circuit
    Notes 1. Although the CSI function is generally called
    SPI, it is also called CSI in this product, so it
    is referred to as such in this manual.
    2. Can be selected only in HS (high-speed main)
    mode
    3. Products with 20 to 52 pins
    4. Products with 64 to 128 pins
    Remark The functions mounted depend on the product.
    See 1.6 Outline of Functions.