PIC24HJ256GP210-I/PT

The PIC24HJXXXGPX06/X08/X10 device family
includes devices with different pin counts (64 and 100
pins), different program memory sizes (64 Kbytes, 128
Kbytes and 256 Kbytes) and different RAM sizes (8
Kbytes and 16 Kbytes).
This makes these families suitable for a wide variety of
high-performance digital signal control applications.
The devices are pin compatible with the dsPIC33F family of devices, and also share a very high degree of
compatibility with the dsPIC30F family devices. This
allows easy migration between device families as may
be necessitated by the specific functionality, computational resource and system cost requirements of the
application.
The PIC24HJXXXGPX06/X08/X10 device family
employs a powerful 16-bit architecture, ideal for
applications that rely on high-speed, repetitive
computations, as well as control.
The 17 x 17 multiplier, hardware support for division
operations, multi-bit data shifter, a large array of 16-bit
working registers and a wide variety of data addressing
modes, together provide the
PIC24HJXXXGPX06/X08/X10 Central Processing Unit
(CPU) with extensive mathematical processing
capability. Flexible and deterministic interrupt handling,
coupled with a powerful array of peripherals, renders
the PIC24HJXXXGPX06/X08/X10 devices suitable for
control applications. Further, Direct Memory Access
(DMA) enables overhead-free transfer of data between
several peripherals and a dedicated DMA RAM.
Reliable, field programmable Flash program memory
ensures scalability of applications that use
PIC24HJXXXGPX06/X08/X10 devices.
Figure 1-1 shows a general block diagram of the
various core and peripheral modules in the
PIC24HJXXXGPX06/X08/X10 family of devices, while
Table 1-1 lists the functions of the various pins shown
in the pinout diagrams.


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    SPECIFICATION

    Operating Range:
    • Up to 40 MIPS operation (at 3.0-3.6V):
    – Industrial temperature range
    (-40°C to +85°C)
    High-Performance CPU:
    • Modified Harvard architecture
    • C compiler optimized instruction set
    • 16-bit wide data path
    • 24-bit wide instructions
    • Linear program memory addressing up to 4M
    instruction words
    • Linear data memory addressing up to 64 Kbytes
    • 71 base instructions: mostly 1 word/1 cycle
    • Sixteen 16-bit General Purpose Registers
    • Flexible and powerful Indirect Addressing modes
    • Software stack
    • 16 x 16 multiply operations
    • 32/16 and 16/16 divide operations
    • Up to ±16-bit data shifts
    Direct Memory Access (DMA):
    • 8-channel hardware DMA
    • 2 Kbytes dual ported DMA buffer area
    (DMA RAM) to store data transferred via DMA:
    – Allows data transfer between RAM and a
    peripheral while CPU is executing code
    (no cycle stealing)
    • Most peripherals support DMA
    Interrupt Controller:
    • 5-cycle latency
    • Up to 61 available interrupt sources
    • Up to five external interrupts
    • Seven programmable priority levels
    • FIve processor exceptions
    Digital I/O:
    • Up to 85 programmable digital I/O pins
    • Wake-up/Interrupt-on-Change on up to 24 pins
    • Output pins can drive from 3.0V to 3.6V
    • All digital input pins are 5V tolerant
    • 4 mA sink on all I/O pins
    On-Chip Flash and SRAM:
    • Flash program memory, up to 256 Kbytes
    • Data SRAM, up to 16 Kbytes (includes 2 Kbytes
    of DMA RAM)
    System Management:
    • Flexible clock options:
    – External, crystal, resonator, internal RC
    – Fully integrated PLL
    – Extremely low jitter PLL
    • Power-up Timer
    • Oscillator Start-up Timer/Stabilizer
    • Watchdog Timer with its own RC oscillator
    • Fail-Safe Clock Monitor
    • Reset by multiple sources
    Power Management:
    • On-chip 2.5V voltage regulator
    • Switch between clock sources in real time
    • Idle, Sleep and Doze modes with fast wake-up
    Timers/Capture/Compare/PWM:
    • Timer/Counters, up to nine 16-bit timers:
    – Can pair up to make four 32-bit timers
    – One timer runs as Real-Time Clock with
    external 32.768 kHz oscillator
    – Programmable prescaler
    • Input Capture (up to eight channels):
    – Capture on up, down or both edges
    – 16-bit capture input functions
    – 4-deep FIFO on each capture
    • Output Compare (up to eight channels):
    – Single or Dual 16-Bit Compare mode
    – 16-bit Glitchless PWM mode

    Communication Modules:
    • 3-wire SPI (up to two modules):
    – Framing supports I/O interface to simple
    codecs
    – Supports 8-bit and 16-bit data
    – Supports all serial clock formats and
    sampling modes
    • I2C™ (up to two modules):
    – Full Multi-Master Slave mode support
    – 7-bit and 10-bit addressing
    – Bus collision detection and arbitration
    – Integrated signal conditioning
    – Slave address masking
    • UART (up to two modules):
    – Interrupt on address bit detect
    – Interrupt on UART error
    – Wake-up on Start bit from Sleep mode
    – 4-character TX and RX FIFO buffers
    – LIN bus support
    – IrDA® encoding and decoding in hardware
    – High-Speed Baud mode
    – Hardware Flow Control with CTS and RTS
    • Enhanced CAN (ECAN™ module) 2.0B active
    (up to two modules):
    – Up to eight transmit and up to 32 receive buffers
    – 16 receive filters and 3 masks
    – Loopback, Listen Only and Listen All
    Messages modes for diagnostics and bus
    monitoring
    – Wake-up on CAN message
    – Automatic processing of Remote
    Transmission Requests
    – FIFO mode using DMA
    – DeviceNet™ addressing support
    Analog-to-Digital Converters:
    • Up to two Analog-to-Digital Converter (ADC)
    modules in a device
    • 10-bit, 1.1 Msps or 12-bit, 500 ksps conversion:
    – Two, four, or eight simultaneous samples
    – Up to 32 input channels with auto-scanning
    – Conversion start can be manual or
    synchronized with one of four trigger sources
    – Conversion possible in Sleep mode
    – ±1 LSb max integral nonlinearity
    – ±1 LSb max differential nonlinearity
    CMOS Flash Technology:
    • Low-power, high-speed Flash technology
    • Fully static design
    • 3.3V (±10%) operating voltage
    • Industrial temperature
    • Low-power consumption
    Packaging:
    • 100-pin TQFP (14x14x1 mm and 12x12x1 mm)
    • 64-pin TQFP (10x10x1 mm)