MT25QL512ABB1EW9-0SIT

The MT25Q is a high-performance multiple input/output serial Flash memory device. It
features a high-speed SPI-compatible bus interface, execute-in-place (XIP) functionality, advanced write protection mechanisms, and extended address access. Innovative,
high-performance, dual and quad input/output commands enable double or quadruple the transfer bandwidth for READ and PROGRAM operations.

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    SPECIFICATION

    • SPI-compatible serial bus interface
    • Single and double transfer rate (STR/DTR)
    • Clock frequency
    – 133 MHz (MAX) for all protocols in STR
    – 90 MHz (MAX) for all protocols in DTR
    • Dual/quad I/O commands for increased throughput up to 90 MB/s
    • Supported protocols in both STR and DTR
    – Extended I/O protocol
    – Dual I/O protocol
    – Quad I/O protocol
    • Execute-in-place (XIP)
    • PROGRAM/ERASE SUSPEND operations
    • Volatile and nonvolatile configuration settings
    • Software reset
    • Reset pin available
    • 3-byte and 4-byte address modes – enable memory
    access beyond 128Mb
    • Dedicated 64-byte OTP area outside main memory
    – Readable and user-lockable
    – Permanent lock with PROGRAM OTP command
    • Erase capability
    – Bulk erase
    – Sector erase 64KB uniform granularity
    – Subsector erase 4KB, 32KB granularity
    • Security and write protection
    – Volatile and nonvolatile locking and software
    write protection for each 64KB sector
    – Nonvolatile configuration locking
    – Password protection
    – Hardware write protection: nonvolatile bits
    (BP[3:0] and TB) define protected area size
    – Program/erase protection during power-up
    – CRC detects accidental changes to raw data
    • Electronic signature
    – JEDEC-standard 3-byte signature (BA20h)
    – Extended device ID: two additional bytes identify
    device factory options
    • JESD47H-compliant
    – Minimum 100,000 ERASE cycles per sector
    – Data retention: 20 years (TYP)
    Options Marking
    • Voltage
    – 2.7–3.6V L
    • Density
    – 512Mb 512
    • Device stacking
    – Monolithic A
    • Device generation B
    • Die revision B
    • Pin configuration
    – HOLD# 1
    – RESET# and HOLD# 8
    • Sector Size
    – 64KB E
    • Packages – JEDEC-standard, RoHScompliant
    – 24-ball T-PBGA 05/6mm × 8mm
    (TBGA24)
    12
    – 16-pin SOP2, 300 mil
    (SO16W, SO16-Wide, SOIC-16)
    SF
    – W-PDFN-8 8mm × 6mm
    (MLP8 8mm × 6mm)
    W9
    • Security features
    – Standard security 0
    • Special options
    – Standard S
    – Automotive A
    • Operating temperature range
    – From –40°C to +85°C IT
    – From –40°C to +105°C AT
    – From –40°C to +125°C UT