• Industry Standard Serial Interface
– IS25LP016D: 16Mbit/2Mbyte
– IS25WP016D: 16Mbit/2Mbyte
– 256 bytes per Programmable Page
– Supports standard SPI, Fast, Dual, Dual
I/O, Quad, Quad I/O, SPI DTR, Dual I/O
DTR, Quad I/O DTR, and QPI
– Supports Serial Flash Discoverable
Parameters (SFDP)
• High Performance Serial Flash (SPI)
– 50MHz Normal and 133Mhz Fast Read
– 532 MHz equivalent QPI
– DTR (Dual Transfer Rate) up to 66MHz
– Selectable Dummy Cycles
– Configurable Drive Strength
– Supports SPI Modes 0 and 3
– More than 100,000 Erase/Program Cycles
– More than 20-year Data Retention
• Flexible & Efficient Memory Architecture
– Chip Erase with Uniform: Sector/Block
Erase (4/32/64 Kbyte)
– Program 1 to 256 Bytes per Page
– Program/Erase Suspend & Resume
• Efficient Read and Program modes
– Low Instruction Overhead Operations
– Continuous Read 8/16/32/64-Byte
Burst Wrap
– Selectable Burst Length
– QPI for Reduced Instruction Overhead
– AutoBoot Operation
• Low Power with Wide Temp. Ranges
– Single Voltage Supply
IS25LP: 2.30V to 3.75V
(1)
IS25WP: 1.65V to 1.95V
– 4 mA Active Read Current (typ.)
– 5 µA Standby Current (typ.)
– 1 µA Deep Power Down (typ.)
– Temp Grades:
Extended: -40°C to +105°C
Auto Grade (A3): -40°C to +125°C
Note:
1. 3.6V for Automotive Grade (A3)
• Advanced Security Protection
– Software and Hardware Write Protection
– Power Supply Lock Protect
– 4×256-Byte Dedicated Security Area
with OTP User-lockable Bits
– 128 bit Unique ID for Each Device
(Call Factory)
• Industry Standard Pin-out & Packages(1,2)
– B = 8-pin SOIC 208mil
– N = 8-pin SOIC 150mil
– V = 8-pin VVSOP 150mil
– K = 8-contact WSON 6x5mm
– U = 8-contact USON 2x3mm
– T = 8-contact USON 4x3mm
– M = 16-pin SOIC 300mil (Call Factory)
– L = 8-contact WSON 8x6mm
– G= 24-ball TFBGA 6x8mm 4×6(Call Factory)
– H = 24-ball TFBGA 6x8mm 5×5 (Call Factory)
– W = KGD (Call Factory)
– Halogen-Free, RoHS & TSCA Compliant