EX-Z12FA-P

The world’s thinnest* sensor dimension of 3 mm 0.118 in has been achieved
by utilizing new semiconductor packaging technology that does not use wire
bonding. The small unit size allows installation of sensors in a narrow space
where only a conventional fiber sensor head could be installed before. The built-in
amplifier also saves on installation space.
* Among photoelectric sensors with built-in amplifier, as of April 2017 in-company survey


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    SPECIFICATION

    The world’s thinnest* sensor dimension of 3 mm 0.118 in has been achieved
    by utilizing new semiconductor packaging technology that does not use wire
    bonding. The small unit size allows installation of sensors in a narrow space
    where only a conventional fiber sensor head could be installed before. The built-in
    amplifier also saves on installation space.
    * Among photoelectric sensors with built-in amplifier, as of April 2017 in-company survey