AM3352BZCZ60

The AM335x microprocessors, based on the ARM Cortex-A8 processor, are enhanced with image,
graphics processing, peripherals and industrial interface options such as EtherCAT and PROFIBUS. The
devices support high-level operating systems (HLOS). Processor SDK Linux® and TI-RTOS are available
free of charge from TI.
The AM335x microprocessor contains the subsystems shown in the Functional Block Diagram and a brief
description of each follows:
The contains the subsystems shown in the Functional Block Diagram and a brief description of each
follows:
The microprocessor unit (MPU) subsystem is based on the ARM Cortex-A8 processor and the PowerVR
SGX™ Graphics Accelerator subsystem provides 3D graphics acceleration to support display and gaming
effects.
The PRU-ICSS is separate from the ARM core, allowing independent operation and clocking for greater
efficiency and flexibility. The PRU-ICSS enables additional peripheral interfaces and real-time protocols
such as EtherCAT, PROFINET, EtherNet/IP, PROFIBUS, Ethernet Powerlink, Sercos, and others.
Additionally, the programmable nature of the PRU-ICSS, along with its access to pins, events and all
system-on-chip (SoC) resources, provides flexibility in implementing fast, real-time responses, specialized
data handling operations, custom peripheral interfaces, and in offloading tasks from the other processor
cores of SoC.


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    SPECIFICATION

    • Up to 1-GHz Sitara™ ARM® Cortex®
    -A8 32‑Bit
    RISC Processor
    – NEON™ SIMD Coprocessor
    – 32KB of L1 Instruction and 32KB of Data Cache
    With Single-Error Detection (Parity)
    – 256KB of L2 Cache With Error Correcting Code
    (ECC)
    – 176KB of On-Chip Boot ROM
    – 64KB of Dedicated RAM
    – Emulation and Debug – JTAG
    – Interrupt Controller (up to 128 Interrupt
    Requests)
    • On-Chip Memory (Shared L3 RAM)
    – 64KB of General-Purpose On-Chip Memory
    Controller (OCMC) RAM
    – Accessible to All Masters
    – Supports Retention for Fast Wakeup
    • External Memory Interfaces (EMIF)
    – mDDR(LPDDR), DDR2, DDR3, DDR3L
    Controller:
    – mDDR: 200-MHz Clock (400-MHz Data Rate)
    – DDR2: 266-MHz Clock (532-MHz Data Rate)
    – DDR3: 400-MHz Clock (800-MHz Data Rate)
    – DDR3L: 400-MHz Clock (800-MHz Data
    Rate)
    – 16-Bit Data Bus
    – 1GB of Total Addressable Space
    – Supports One x16 or Two x8 Memory Device
    Configurations
    – General-Purpose Memory Controller (GPMC)
    – Flexible 8-Bit and 16-Bit Asynchronous
    Memory Interface With up to Seven Chip
    Selects (NAND, NOR, Muxed-NOR, SRAM)
    – Uses BCH Code to Support 4-, 8-, or 16-Bit
    ECC
    – Uses Hamming Code to Support 1-Bit ECC
    – Error Locator Module (ELM)
    – Used in Conjunction With the GPMC to
    Locate Addresses of Data Errors from
    Syndrome Polynomials Generated Using a
    BCH Algorithm
    – Supports 4-, 8-, and 16-Bit per 512-Byte
    Block Error Location Based on BCH
    Algorithms
    • Programmable Real-Time Unit Subsystem and
    Industrial Communication Subsystem (PRU-ICSS)
    – Supports Protocols such as EtherCAT®
    ,
    PROFIBUS, PROFINET, EtherNet/IP™, and
    More
    – Two Programmable Real-Time Units (PRUs)
    – 32-Bit Load/Store RISC Processor Capable
    of Running at 200 MHz
    – 8KB of Instruction RAM With Single-Error
    Detection (Parity)
    – 8KB of Data RAM With Single-Error Detection
    (Parity)
    – Single-Cycle 32-Bit Multiplier With 64-Bit
    Accumulator
    – Enhanced GPIO Module Provides ShiftIn/Out Support and Parallel Latch on External
    Signal
    – 12KB of Shared RAM With Single-Error
    Detection (Parity)
    – Three 120-Byte Register Banks Accessible by
    Each PRU
    – Interrupt Controller (INTC) for Handling System
    Input Events
    – Local Interconnect Bus for Connecting Internal
    and External Masters to the Resources Inside
    the PRU-ICSS
    – Peripherals Inside the PRU-ICSS:
    – One UART Port With Flow Control Pins,
    Supports up to 12 Mbps
    – One Enhanced Capture (eCAP) Module
    – Two MII Ethernet Ports that Support Industrial
    Ethernet, such as EtherCAT
    – One MDIO Port
    • Power, Reset, and Clock Management (PRCM)
    Module
    – Controls the Entry and Exit of Stand-By and
    Deep-Sleep Modes
    – Responsible for Sleep Sequencing, Power
    Domain Switch-Off Sequencing, Wake-Up
    Sequencing, and Power Domain Switch-On
    Sequencing
    – Clocks
    – Integrated 15- to 35-MHz High-Frequency
    Oscillator Used to Generate a Reference
    Clock for Various System and Peripheral
    Clocks
    – Supports Individual Clock Enable and Disable
    Control for Subsystems and Peripherals to
    Facilitate Reduced Power Consumption
    – Five ADPLLs to Generate System Clocks
    (MPU Subsystem, DDR Interface, USB and
    Peripherals [MMC and SD, UART, SPI, I
    2C], L3, L4, Ethernet, GFX [SGX530], LCD Pixel
    Clock)
    – Power
    – Two Nonswitchable Power Domains (RealTime Clock [RTC], Wake-Up Logic
    [WAKEUP])
    – Three Switchable Power Domains (MPU
    Subsystem [MPU], SGX530 [GFX],
    Peripherals and Infrastructure [PER])
    – Implements SmartReflex™ Class 2B for Core
    Voltage Scaling Based On Die Temperature,
    Process Variation, and Performance
    (Adaptive Voltage Scaling [AVS])
    – Dynamic Voltage Frequency Scaling (DVFS)
    • Real-Time Clock (RTC)
    – Real-Time Date (Day-Month-Year-Day of Week)
    and Time (Hours-Minutes-Seconds) Information
    – Internal 32.768-kHz Oscillator, RTC Logic and
    1.1-V Internal LDO
    – Independent Power-on-Reset
    (RTC_PWRONRSTn) Input
    – Dedicated Input Pin (EXT_WAKEUP) for
    External Wake Events
    – Programmable Alarm Can be Used to Generate
    Internal Interrupts to the PRCM (for Wakeup) or
    Cortex-A8 (for Event Notification)
    – Programmable Alarm Can be Used With
    External Output (PMIC_POWER_EN) to Enable
    the Power Management IC to Restore Non-RTC
    Power Domains
    • Peripherals
    – Up to Two USB 2.0 High-Speed DRD (DualRole Device) Ports With Integrated PHY
    – Up to Two Industrial Gigabit Ethernet MACs (10,
    100, 1000 Mbps)
    – Integrated Switch
    – Each MAC Supports MII, RMII, RGMII, and
    MDIO Interfaces
    – Ethernet MACs and Switch Can Operate
    Independent of Other Functions
    – IEEE 1588v1 Precision Time Protocol (PTP)
    – Up to Two Controller-Area Network (CAN) Ports
    – Supports CAN Version 2 Parts A and B
    – Up to Two Multichannel Audio Serial Ports
    (McASPs)
    – Transmit and Receive Clocks up to 50 MHz
    – Up to Four Serial Data Pins per McASP Port
    With Independent TX and RX Clocks
    – Supports Time Division Multiplexing (TDM),
    Inter-IC Sound (I2S), and Similar Formats
    – Supports Digital Audio Interface Transmission
    (SPDIF, IEC60958-1, and AES-3 Formats)
    – FIFO Buffers for Transmit and Receive (256
    Bytes)
    – Up to Six UARTs
    – All UARTs Support IrDA and CIR Modes
    – All UARTs Support RTS and CTS Flow
    Control
    – UART1 Supports Full Modem Control
    – Up to Two Master and Slave McSPI Serial
    Interfaces
    – Up to Two Chip Selects
    – Up to 48 MHz
    – Up to Three MMC, SD, SDIO Ports
    – 1-, 4- and 8-Bit MMC, SD, SDIO Modes
    – MMCSD0 has Dedicated Power Rail for 1.8‑V
    or 3.3-V Operation
    – Up to 48-MHz Data Transfer Rate
    – Supports Card Detect and Write Protect
    – Complies With MMC4.3, SD, SDIO 2.0
    Specifications
    – Up to Three I
    2C Master and Slave Interfaces
    – Standard Mode (up to 100 kHz)
    – Fast Mode (up to 400 kHz)
    – Up to Four Banks of General-Purpose I/O
    (GPIO) Pins
    – 32 GPIO Pins per Bank (Multiplexed With
    Other Functional Pins)
    – GPIO Pins Can be Used as Interrupt Inputs
    (up to Two Interrupt Inputs per Bank)
    – Up to Three External DMA Event Inputs that can
    Also be Used as Interrupt Inputs
    – Eight 32-Bit General-Purpose Timers
    – DMTIMER1 is a 1-ms Timer Used for
    Operating System (OS) Ticks
    – DMTIMER4–DMTIMER7 are Pinned Out
    – One Watchdog Timer
    – SGX530 3D Graphics Engine
    – Tile-Based Architecture Delivering up to 20
    Million Polygons per Second
    – Universal Scalable Shader Engine (USSE) is
    a Multithreaded Engine Incorporating Pixel
    and Vertex Shader Functionality
    – Advanced Shader Feature Set in Excess of
    Microsoft VS3.0, PS3.0, and OGL2.0
    – Industry Standard API Support of Direct3D
    Mobile, OGL-ES 1.1 and 2.0, and OpenMax
    – Fine-Grained Task Switching, Load
    Balancing, and Power Management
    – Advanced Geometry DMA-Driven Operation
    for Minimum CPU Interaction
    – Programmable High-Quality Image AntiAliasing
    – Fully Virtualized Memory Addressing for OS
    Operation in a Unified Memory Architecture
    – LCD Controller
    – Up to 24-Bit Data Output; 8 Bits per Pixel
    (RGB)
    – Resolution up to 2048 × 2048 (With
    Maximum 126-MHz Pixel Clock)
    – Integrated LCD Interface Display Driver
    (LIDD) Controller
    – Integrated Raster Controller
    – Integrated DMA Engine to Pull Data from the
    External Frame Buffer Without Burdening the
    Processor via Interrupts or a Firmware Timer
    – 512-Word Deep Internal FIFO
    – Supported Display Types:
    – Character Displays – Uses LIDD Controller
    to Program these Displays
    – Passive Matrix LCD Displays – Uses LCD
    Raster Display Controller to Provide
    Timing and Data for Constant Graphics
    Refresh to a Passive Display
    – Active Matrix LCD Displays – Uses
    External Frame Buffer Space and the
    Internal DMA Engine to Drive Streaming
    Data to the Panel
    – 12-Bit Successive Approximation Register
    (SAR) ADC
    – 200K Samples per Second
    – Input can be Selected from any of the Eight
    Analog Inputs Multiplexed Through an 8:1
    Analog Switch
    – Can be Configured to Operate as a 4-Wire, 5-
    Wire, or 8-Wire Resistive Touch Screen
    Controller (TSC) Interface
    – Up to Three 32-Bit eCAP Modules
    – Configurable as Three Capture Inputs or
    Three Auxiliary PWM Outputs
    – Up to Three Enhanced High-Resolution PWM
    Modules (eHRPWMs)
    – Dedicated 16-Bit Time-Base Counter With
    Time and Frequency Controls
    – Configurable as Six Single-Ended, Six DualEdge Symmetric, or Three Dual-Edge
    Asymmetric Outputs
    – Up to Three 32-Bit Enhanced Quadrature
    Encoder Pulse (eQEP) Modules
    • Device Identification
    – Contains Electrical Fuse Farm (FuseFarm) of
    Which Some Bits are Factory Programmable
    – Production ID
    – Device Part Number (Unique JTAG ID)
    – Device Revision (Readable by Host ARM)
    • Debug Interface Support
    – JTAG and cJTAG for ARM (Cortex-A8 and
    PRCM), PRU-ICSS Debug
    – Supports Device Boundary Scan
    – Supports IEEE 1500
    • DMA
    – On-Chip Enhanced DMA Controller (EDMA) has
    Three Third-Party Transfer Controllers (TPTCs)
    and One Third-Party Channel Controller
    (TPCC), Which Supports up to 64
    Programmable Logical Channels and Eight
    QDMA Channels. EDMA is Used for:
    – Transfers to and from On-Chip Memories
    – Transfers to and from External Storage
    (EMIF, GPMC, Slave Peripherals)
    • Inter-Processor Communication (IPC)
    – Integrates Hardware-Based Mailbox for IPC and
    Spinlock for Process Synchronization Between
    Cortex-A8, PRCM, and PRU-ICSS
    – Mailbox Registers that Generate Interrupts
    – Four Initiators (Cortex-A8, PRCM, PRU0,
    PRU1)
    – Spinlock has 128 Software-Assigned Lock
    Registers
    • Security
    – Crypto Hardware Accelerators (AES, SHA,
    RNG)
    – Secure Boot (optional; requires custom part
    engagement with TI)
    • Boot Modes
    – Boot Mode is Selected Through Boot
    Configuration Pins Latched on the Rising Edge
    of the PWRONRSTn Reset Input Pin
    • Packages:
    – 298-Pin S-PBGA-N298 Via Channel Package
    (ZCE Suffix), 0.65-mm Ball Pitch
    – 324-Pin S-PBGA-N324 Package
    (ZCZ Suffix), 0.80-mm Ball Pitch