AD9364BBCZ

The AD9364 is a high performance, highly integrated radio frequency (RF) Agile Transceiver™ designed for use in 3G and 4G base
station applications. Its programmability and wideband capability
make it ideal for a broad range of transceiver applications.
The device combines an RF front end with a flexible mixed-signal
baseband section and integrated frequency synthesizers, simplifying design-in by providing a configurable digital interface to a
processor. The AD9364 operates in the 70 MHz to 6.0 GHz range,
covering most licensed and unlicensed bands. Channel bandwidths
from less than 200 kHz to 56 MHz are supported.
The direct conversion receiver has state-of-the-art noise figure
and linearity. The receive (Rx) subsystem includes independent
automatic gain control (AGC), dc offset correction, quadrature
correction, and digital filtering, thereby eliminating the need for
these functions in the digital baseband. The AD9364 also has
flexible manual gain modes that can be externally controlled.
Two high dynamic range ADCs digitize the received I and Q
signals and pass them through configurable decimation filters
and 128-tap FIR filters to produce a 12-bit output signal at the
appropriate sample rate.
The transmitter uses a direct conversion architecture that achieves
high modulation accuracy with ultralow noise. This transmitter
design produces a Tx EVM of ≤−40 dB, allowing significant system
margin for the external power amplifier (PA) selection. The onboard transmit (Tx) power monitor can be used as a power
detector, enabling highly accurate Tx power measurements.
The fully integrated phase-locked loops (PLLs) provide low
power fractional-N frequency synthesis for all Rx and Tx channels.
All VCO and loop filter components are integrated.
The core of the AD9364 can be powered directly from a 1.3 V
regulator. The IC is controlled via a standard 4-wire serial port and
four real-time input control pins. Comprehensive power-down
modes are included to minimize power consumption during
normal use. The AD9364 is packaged in a 10 mm × 10 mm,
144-ball chip scale package ball grid array (CSP_BGA).