787261003

25° angle inclination to the horizontal (Angled version) Gives up to 45% vertical space savings over
Standard vertical versions
Ultra-low seating plane of 1.10mm (Ultra low-profile
version)
Frees up vertical module space to allow use of highdensity DIMMs while maintaining the same design
height; Enables the use of very low-profile modules
with seating heights below 2.80mm (maximum) in
ATCA* blade systems
Lower current of 0.75A per terminal compared to 1.0A
for ULP DDR3 DIMM versions
For bigger energy cost savings
Streamlined housing and latch design (Aerodynamic
series)
Minimizes trapping of hot air around high-density
memory modules during operation
Metal-reinforced latch tower housing (Angled,
Aerodynamic and Standard series)
Prevents cleavage or separation of tower bridge due
to wear and tear
Multiple soldertail length options available for Throughhole and Press-fit sockets (Aerodynamic and Standard
series)
To suit various PCB thicknesses
Flush soldertail design for SMT socket (Standard series
only)
Minimizes accidental damage to terminals due to
bending
Anti-stubbing mating contacts (All series) Provide smooth module lead-in and contact grip
during insertion