MSP5.0A-M3/89A

Case: MicroSMP (DO-219AD)
Molding compound meets UL 94 V-0 flammability rating
Base P/N-M3 – halogen-free, RoHS-compliant, and
industrial grade
Base P/NHM3 – halogen-free, RoHS-compliant, and
automotive grade
Terminals: matte tin plated leads, solderable per
J-STD-002 and JESD 22-B102
M3 suffix meets JESD 201 class 2 whisker test, HM3 suffix
meets JESD 201 class 2 whisker test
Polarity: color band denotes the cathode end

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    SPECIFICATION

    • Very low profile – typical height of 0.65 mm
    • Ideal for automated placement
    • Oxide planar chip junction
    • Unidirectional polarity only
    • Peak pulse power: 150 W (10 μs/1000 μs)
    • ESD capability: 15 kV (air), 8 kV (contact)
    • Meets MSL level 1, per J-STD-020C, LF maximum peak
    of 260 °C
    • AEC-Q101 qualified
    • Not recommended for PCB bottom side wave mounting
    • Material categorization: for definitions of compliance
    please see www.vishay.com/doc?99912