● Small size and lightweight
● High reliability : Metal glaze thick film resistive element and three layers of electrodes
● Compatible with placement machines : Taping packaging available
● Suitable for both reflow and flow soldering
● Reference standard : IEC 60115-8,JIS C 5201-8,JEITA RC-2134C
● AEC-Q200 compliant (except ERJXG, ERJ1GN)
● RoHS compliant