• Average forward current: IF(AV)
≤ 3 A
• Reverse voltage: VR ≤ 40 V
• Low forward voltage
• Low leakage current due to Trench MEGA Schottky technology
• High power capability due to clip-bonding technology
• Small and flat lead SMD plastic package
• Suitable for both reflow and wave soldering
• Qualified according to AEC-Q101 and recommended for use in automotive applications