SN74AUP1G08QDCKRQ1

The AUP family is TI’s premier solution to the low-power needs of the industry in battery-powered portable applications. This family ensures a very low static- and dynamic-power consumption across the entire VCC range of 0.8 V to 3.6 V, resulting in increased battery life (see Figure 1). This product also maintains excellent signal integrity (see the very low undershoot and overshoot characteristics shown in Figure 2).

This single 2-input positive-AND gate performs the Boolean function: Y = A • B or Y = A\ + B\ in positive logic.

NanoStar package technology is a major breakthrough in integrated circuit (IC) packaging concepts, because it uses the die as the package.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.


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    SPECIFICATION

    • AEC-Q100 Qualified with the Following Results:
      • Device Temperature Grade 1: –40°C to 125°C Ambient Operating Temperature Range
      • Device HBM ESD Classification Level H2
      • Device CDM ESD Classification Level C3B
    • Available in the Texas Instruments NanoStar Package
    • Low Static-Power Consumption:
      ICC = 0.9 µA Max
    • Low Dynamic-Power Consumption:
      Cpd = 4.3 pF Typ at 3.3 V
    • Low Input Capacitance: Ci = 1.5 pF Typ
    • Low Noise: Overshoot and Undershoot
      < 10% of VCC
    • Ioff Supports Partial-Power-Down Mode Operation
    • Schmitt-Trigger Action Allows Slow Input Transition and Better
      Switching Noise Immunity at the Input (Vhys = 250 mV, Typ at
      3.3 V)
    • Wide Operating VCC Range of 0.8 V to 3.6 V
    • Optimized for 3.3-V Operation
    • 3.6-V Input/Output (I/O) Tolerant to Support Mixed-Mode Signal Operation
    • tpd = 4.3 ns Max at 3.3 V
    • Suitable for Point-to-Point Applications
    • Latch-Up Performance Exceeds 100 mA Per JESD-78, Class II