SMBJ9.0CA

• Excellent clamping
capability
• Low incremental surge
resistance
• Typical IR less than 1μA
when VBR min>12V
• For surface mounted
applications to optimize
board space
• Low profile package
• Typical failure mode is
short from over-specified
voltage or current
• Whisker test is conducted
based on JEDEC
JESD201A per its table 4a
and 4c
• IEC-61000-4-2 ESD
30kV(Air), 30kV (Contact)
• ESD protection of data
lines in accordance with
IEC 61000-4-2
• EFT protection of data
lines in accordance with
IEC 61000-4-4
• Built-in strain relief
• Fast response time:
typically less than 1.0ps
from 0V to VBR min
• 600W peak pulse power
capability at 10/1000μs
waveform, repetition rate
(duty cycles):0.01%
• High temperature to reflow
soldering guaranteed:
260°C/30sec
• VBR @ TJ
= VBR@25°C
x (1+αT x (TJ
– 25))
(αT:Temperature
Coefficient, typical value is
0.1%)
• UL Recognized compound
meeting flammability
classification V-0
• Meet MSL level1, per
J-STD-020, LF maximun
peak of 260°C
• Matte tin lead–free plated
• Halogen free and RoHS
compliant
• Pb-free E3 means 2nd
level interconnect is Pbfree and the terminal finish
material is tin(Sn) (IPC/
JEDEC J-STD-609A.01)
• UL Recognized to ANSI/
UL 497B: Protectors for
Data Communications and
Fire-Alarm Circuits.