• Average forward current: IF(AV)
≤ 10 A
• Reverse voltage: VR ≤ 100 V
• Low leakage current due to high Schottky barrier technology
• Low forward voltage
• High power capability due to clip-bonding technology and heat sink
• High temperature Tj
≤ 175 °C
• Small and thin SMD power plastic package, typical height 0.78 mm
• AEC-Q101 qualified